دعا: +086 0755 85241496 البريد الالكترونى: service@qycltd.com

التقنية الاتصال |

CompanyNews-Page38of307-Flip-ChipPackageSubstratemanufacturer-Page38

أخبار الشركة

وطن

أخبار الشركة

Flip Chip CSP Package Substrate

2024-02-09 أخبار الشركة / خبر / اخطار / أخبار التجارة

Flip Chip CSP Package Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

Read more
Chip-scale Package Substrate Manufacturer

2024-02-08 أخبار الشركة / خبر / اخطار / أخبار التجارة

Chip-scale package Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers.

Read more
Cavity Substrate/PCB Manufacturer

2024-02-07 أخبار الشركة / خبر / اخطار / أخبار التجارة

Cavity Substrate/PCB Manufacturer the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

Read more
FCCSP Flip Chip CSP Substrate Manufacturer

2024-02-06 أخبار الشركة / خبر / اخطار / أخبار التجارة

FCCSP Flip Chip CSP substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

Read more
Embedded Cavity PCB/Substrate Manufacturer

2024-02-05 أخبار الشركة / خبر / اخطار / أخبار التجارة

Professional Embedded Cavity PCB/Substrate Manufacturer, we mainly produce ultra-small bump pitch Cavity substrate/PCBs, ultra-small trace and spacing packaging cavity substrate and HDI Cavity PCBs.

Read more
Flip Chip CSP (FCCSP) Manufacturer

2024-02-02 أخبار الشركة / خبر / اخطار / أخبار التجارة

Flip Chip CSP (FCCSP) Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

Read more

+086 0755 85241496

service@qycltd.com

اترك رسالة