TECHNOLOGY-Flip-ChipPackageSubstratemanufacturer

TECHNOLOGY

At present, our company can produce various high-density packaging substrates from 4 to 18 layers. We have many types of packaging substrate materials, which are suitable for small-pitch packaging substrates or small-circuit circuit boards. The minimum bump pitch is 100um. , the minimum trace and spacing is 9um/9um, most customers’ products are 20um to 30um, the higher the number of layers and the smaller the spacing, will increase our production costs. On the contrary, the larger the spacing and the lower the number of layers, the production cost will also be Lower. When you design the original file, if you have any questions about the design details, please feel free to contact us and we will serve you free of charge. Because all complete design data is currently confidential, we cannot fully disclose these designs and production references, and can only display some key data.

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