دعا: +086 0755 85241496 البريد الالكترونى: service@qycltd.com

التقنية الاتصال |

CompanyNews-Page42of307-Flip-ChipPackageSubstratemanufacturer-Page42

أخبار الشركة

وطن

أخبار الشركة

What is a Semiconductor Substrate?

2024-01-08 أخبار الشركة / خبر / اخطار / أخبار التجارة

Professional Semiconductor substrate supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs.

Read more
What is Semiconductor Packaging Substrate?

2024-01-05 أخبار الشركة / خبر / اخطار / أخبار التجارة

Semiconductor Packaging Substrate Maker. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

Read more
What is an FCBGA substrate manufacturer?

2024-01-04 أخبار الشركة / خبر / اخطار / أخبار التجارة

FCBGA substrate manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers.

Read more
What is Packaging Substrate Manufacturer?

2024-01-03 أخبار الشركة / خبر / اخطار / أخبار التجارة

Packaging Substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

Read more
What Is Semiconductor Package Substrate?

2024-01-02 أخبار الشركة / خبر / اخطار / أخبار التجارة

Semiconductor Substrate Supplier. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

Read more
What is Ceramic package substrate?

2024-01-01 أخبار الشركة / خبر / اخطار / أخبار التجارة

Professional Ceramic Package Substrate Supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.

Read more

+086 0755 85241496

service@qycltd.com

اترك رسالة