أخبار الشركة

• 

  What is a Flip Chip Package Substrate

  2023-12-05 أخبار الشركة / خبر / اخطار / أخبار التجارة

  Flip Chip Package Substrate Manufacturing .High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology

  Read more

• 

  Ajimomoto Package Substrate

  2023-12-04 أخبار الشركة / خبر / اخطار / أخبار التجارة

  Ajimomoto Package Substrate Manufacturing. High speed material and Low CTE (Coefficient of Thermal Expansion). The Package Substrate CTE (Coefficient of Thermal Expansion) refers to the thermal expansion characteristics of the material used in the substrate of electronic packages. The substrate is a foundational component in electronic devices, providing a surface…

  Read more

• 

  FCBGA Substrate Supply

  2023-12-01 أخبار الشركة / خبر / اخطار / أخبار التجارة

  FCBGA Substrate Supply. Introduction of Package substrate Materials. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

  Read more

• 

  Build-up Structure FC-BGA|Organic Package

  2023-11-30 أخبار الشركة / خبر / اخطار / أخبار التجارة

  FC/BGA Structure Substrate Provider. FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.

  Read more

• 

  Why is an organic substrate commonly used in electronic packaging?

  2023-11-29 أخبار الشركة / خبر / اخطار / أخبار التجارة

  Organic Package Substrates Maker. FC-BGA substrates are semiconductor packages with fine design rule and high reliability. QYC provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.

  Read more

• 

  Build-up Structure FC-BGA

  2023-11-28 أخبار الشركة / خبر / اخطار / أخبار التجارة

  Build-up Structure FC-BGA Supply. We offers High Density Build Up (HDBU) substrates using ultra high density routing and 50 micron vias by using laser via formation and dry film resist lamination for high performance flip chip IC devices .

  Read more