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What Is the Definition of FC BGA Substrate?

2023-12-29 أخبار الشركة / خبر / اخطار / أخبار التجارة

Semiconductor FC BGA substrate Manufacturer. The best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 9um to 25um trace and spacing.

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What is Semiconductor BGA Substrate?

2023-12-28 أخبار الشركة / خبر / اخطار / أخبار التجارة

Semiconductor BGA Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers.

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What Is Rigid-Flex BGA Substrate?

2023-12-27 أخبار الشركة / خبر / اخطار / أخبار التجارة

Rigid-flex BGA Substrate Supplier. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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What is Rigid-Flex Packaging Substrate?

2023-12-26 أخبار الشركة / خبر / اخطار / أخبار التجارة

Rigid-flex packaging substrate manufacturing. High speed and high frequency material packaging substrate supplier. Advanced packaging substrate production process and technology.

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What is Ceramic Packaging Substrate?

2023-12-25 أخبار الشركة / خبر / اخطار / أخبار التجارة

We are a professional Ceramic substrate supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.

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What is Semiconductor Package Substrate?

2023-12-22 أخبار الشركة / خبر / اخطار / أخبار التجارة

Semiconductor package and Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers.

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+086 0755 85241496

service@qycltd.com

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