دعا: +086 0755 85241496 البريد الالكترونى: service@qycltd.com

التقنية الاتصال |

 

CavityPCB/SubstrateManufacturerandpackagesubstratemanufacturer.WeuseadvancedMsapandSaptechnology-Page2of13-Flip-ChipPackageSubstratemanufacturer-Page2

Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

  1. وطن
  2. Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

الهاتف +086 0755 85241496

واتس اب +8615014077679

البريد الالكترونى service@qycltd.com

اترك رسالة