Rufen: +086 0755 85241496 E-Mail: service@qycltd.com

Technologie Kontakt |

CompanyNews-Page13of307-Flip-ChipPackageSubstratemanufacturer-Page13

Unternehmensnachrichten

Heim

Unternehmensnachrichten

TU862HF Materials PCB Manufacturer

2024-05-19 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

TU862HF Materials PCB Manufacturer TU862HF Materials PCB Manufacturer,TU862HF Materials PCB is a specialized laminate for high-frequency circuits, known for its excellent electrical performance and stability. Its substrate is made of polytetrafluoroethylene (PTFE), offering low dielectric constant and low loss factor, ideal for applications requiring precise signal transmission. The copper foil…

Read more
Microwave Circuit PCB Manufacturer

2024-05-18 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Microwave Circuit PCB Manufacturer Microwave Circuit PCB Manufacturer,Microwave Circuit PCBs are specialized printed circuit boards designed to handle high-frequency signals ranging from 1 GHz to 300 GHz. Engineered with materials like PTFE composites or ceramic-filled hydrocarbons, they maintain low dielectric loss and stable electrical properties crucial for high-frequency applications. These…

Read more
Step cavity PCB Manufacturer

2024-05-17 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Step cavity PCB Manufacturer Step cavity PCB Manufacturer,Step cavity PCBs feature recessed areas or cavities at varying depths within the board, enabling the integration of components at different levels beneath the surface. This advanced PCB technology allows for reduced board thickness, improved spatial efficiency, and enhanced thermal management. Commonly used…

Read more
Advanced BGA Substrate Manufacturer

2024-05-16 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Advanced BGA Substrate Manufacturer Advanced BGA Substrate Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology Advanced BGA Substrate (ABS) is a cutting-edge solution revolutionizing the landscape of integrated circuit packaging. Engineered with precision and innovation, ABS offers unparalleled performance, reliability, and versatility…

Read more
Rogers Antenna PCB Manufacturer

2024-05-16 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Rogers Antenna PCB Manufacturer We are a professional Rogers Antenna PCB Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Rogers Antenna PCBs are advanced printed circuit boards specifically engineered for high-frequency antenna applications. Utilizing specialized materials from Rogers Corporation, these PCBs offer exceptional…

Read more
Molded Interconnect Substrate Manufacturer

2024-05-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Molded Interconnect Substrate Manufacturer We are a professional Molded Interconnect Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Molded Interconnect Substrates (MIS) revolutionize electronics manufacturing by seamlessly integrating structural and electrical functionalities into a single compact component. These substrates, typically composed of…

Read more

+086 0755 85241496

service@qycltd.com

Hinterlasse eine Nachricht