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Flip Chip PCBs Manufacturer

2024-05-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip PCBs Manufacturer Flip Chip PCBs Manufacturer,Flip Chip PCBs are advanced printed circuit boards where integrated circuits (ICs) are mounted upside down directly onto the substrate using solder bumps. This configuration shortens electrical paths, improving signal integrity and enabling higher I/O density. It also enhances thermal management by efficiently…

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Radar/Antenna Substrate Manufacturer

2024-05-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Radar/Antenna Substrate Manufacturer Radar/Antenna Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. To use the High frequency and high speed materials. Radar/antenna substrate…

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Aviation Substrate Manufacturer

2024-05-05 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Aviation Substrate Manufacturer What is Aviation Substrate (AS)? Aviation Substrate Manufacturer and BGA package substrate Supplier. We use advanced Msap and Sap technology to produce the High multilayer interconnection bga substrates from 4 to 22 layers. Aviation Substrate (AS) refers to a comprehensive framework of technologies and systems designed specifically…

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Showa Denko MCL-E-700G package substrate Manufacturer

2024-05-05 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Showa Denko MCL-E-700G package substrate Manufacturer What is a Showa Denko MCL-E-700G package substrate? Showa Denko MCL-E-700G package substrate Manufacturer, the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. The Showa Denko MCL-E-700G package substrate is…

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Ajinomoto GL102R8HF package substrate Manufacturer

2024-05-04 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ajinomoto GL102R8HF package substrate Manufacturer Ajinomoto GL102R8HF package substrate Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology Ajinomoto GL102R8HF package substrate is a high-performance foundation for semiconductor packaging, designed to meet the demanding requirements of modern electronic devices. Crafted with precision and…

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Ceramics Substrate Manufacturer

2024-05-04 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ceramics Substrate Manufacturer We are a professional Ceramics Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Ceramics substrates are the unsung heroes of modern electronics, providing a sturdy and reliable foundation for a myriad of electronic components. Crafted from advanced ceramic materials…

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