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  IPC Class III PCB Manufacturer

  2024-05-03 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  IPC Class III PCB Manufacturer IPC Class III PCB Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. IPC Class III PCBs represent the pinnacle…

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  Ajinomoto GZ41R2H package substrate Manufacturer

  2024-05-03 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  Ajinomoto GZ41R2H package substrate Manufacturer Ajinomoto GZ41R2H package substrate Manufacturer and package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers, Ajinomoto GZ41R2H package substrate represents a pinnacle of technological advancement in the realm of semiconductor packaging. Crafted with precision and innovation…

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  Showa Denko MCL-E-770G package substrate Manufacturer

  2024-05-02 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  Showa Denko MCL-E-770G package substrate Manufacturer Showa Denko MCL-E-770G package substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. Showa Denko MCL-E-770G package substrates represent a pinnacle of innovation in semiconductor packaging. Engineered by…

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  Hersteller von ultradünnen Antennenplatinen

  2024-05-02 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  Ultrathin Antenna PCB Manufacturer Ultrathin Antenna PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology Ultrathin Antenna PCBs represent a cutting-edge solution in the realm of wireless communication technology. These specialized printed circuit boards integrate ultrathin antennas, meticulously designed to operate within…

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  Hersteller von Ajinomoto GXT31R2 Verpackungssubstrat

  2024-05-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  Ajinomoto GXT31R2 package substrate Manufacturer We are a professional Ajinomoto GXT31R2 package substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. The Ajinomoto GXT31R2 package substrate represents a pinnacle of semiconductor packaging innovation. Engineered by Ajinomoto Co., Ltd., a renowned Japanese company…

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  Radio Frequency Cavity PCB Manufacturer

  2024-05-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  Radio Frequency Cavity PCB Manufacturer Radio Frequency Cavity PCB Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. Radio Frequency (RF) cavity PCBs are specialized…

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