Rufen: +086 0755 85241496 E-Mail: service@qycltd.com

Technologie Kontakt |

CompanyNews-Page30of307-Flip-ChipPackageSubstratemanufacturer-Page30

Unternehmensnachrichten

Heim

Unternehmensnachrichten

3D Ceramic Packages Substrate manufacturing

2024-03-25 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

3D Ceramic Packages Substrate manufacturing 3D Ceramic Packages Substrate manufacturing, Advanced 3D production technology, professional team, fast delivery, stable quality. We produce various ceramic substrates and PCBs. 3D Ceramic Packages Substrates represent a cutting-edge advancement in semiconductor packaging technology. These substrates are engineered with multiple layers of ceramic material, intricately…

Read more
Mixed dielectric PCB manufacturing

2024-03-25 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Mixed dielectric PCB manufacturing Mixed dielectric PCB manufacturing, FR4/High speed/high frequency Mixed dielectric PCB manufacturer. Professional PCB production company. High quality and fast lead time. Mixed Dielectric PCBs are advanced printed circuit boards that integrate multiple types of dielectric materials within their construction. Unlike traditional PCBs that use a single…

Read more
Embedded IC PCB manufacturing

2024-03-24 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Embedded IC PCB manufacturing Embedded IC PCB manufacturing, Open a cavity or multiple cavity on the PCBs substrates. and put the IC in the cavity and assemble. we made this cavity PCBs from 4 layer to 30 layers. Advanced production technology and fast shipping time. Embedded IC PCBs, or Embedded…

Read more
Microvia Substrates manufacturing

2024-03-23 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Microvia Substrates manufacturing Microvia Substrates manufacturing. Extra small size via holes HDI PCBs or Microvia Package BGA Substrates manufacturer. the best samllest laser via hole size are 50um. when you design this smaller via holes. The thickness of each layer of dielectric should also be designed to be thinner. Microvia…

Read more
Embedded cavity PCB manufacturing

2024-03-22 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Embedded cavity PCB manufacturing Embedded cavity PCB manufacturing. Open Cavity on the PCB substrates. Open one or Open multi-Cavity on the PCBs. we have made this types cavity PCB from 3 layer to 30 layers. High quality and fast lead time. and We used the base material as you requested.…

Read more
Multi cavity substrates manufacturing

2024-03-21 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Multi cavity substrates manufacturing Multi Cavity Substrates Manufacturing. Open multiple cavity on the PCB or BGA substrates. Professional Cavity Substrates supplier. we offer Cavity PCBs from 3 layer to 30 layers. Multi cavity substrates (MCS) are specialized substrates utilized in electronic manufacturing, particularly in high-frequency applications such as wireless communication…

Read more

+086 0755 85241496

service@qycltd.com

Hinterlasse eine Nachricht