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Substrate Packaging Manufacturer

2024-03-08 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Substrate Packaging Manufacturer What is Substrate Packaging? Substrate Packaging Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers, Substrate packaging typically refers to the process of encapsulating or packaging semiconductor substrates, also known as chips or dies, for…

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Organic Packaging Chip Substrates Manufacturer

2024-03-07 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Organic Packaging Chip Substrates Manufacturer What are Organic Packaging Chip Substrates? Organic Packaging Chip Substrates Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. Organic Packaging Chip Substrates, also known as organic substrates or organic…

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Top 10 Packaging Substrate Manufacturer

2024-03-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Top 10 Packaging Substrate Manufacturer What is Top 10 Packaging Substrate? The "Top 10 Packaging Substrates" typically refers to the most commonly used materials for packaging electronic components or devices. These substrates are chosen based on their electrical, thermal, mechanical, and cost-related properties, as well as their suitability for various…

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Top 10 package Substrate Manufacturer

2024-03-05 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Top 10 package Substrate Manufacturer What are Top 10 Verpackungs-Substrat? We are a professional Top 10 package Substrate Manufacturer supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. The term "Top 10 Verpackungs-Substrat" might not be on everyone's lips, but let's…

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Global Packaging Substrate Manufacturer

2024-03-04 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Global Packaging Substrate Manufacturer. the best samllest bump pitch with 100um, the best Microtrace are 9um. and the smallest gap are 9um. Tost of the design are 15um to 30um trace and spacing.

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Global FCBGA Package Substrate

2024-03-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Global FCBGA package Substrate Manufacturer and Microtrace substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers.

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