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What is Global Packaging Substrate?

2024-02-29 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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Global Semiconductor Substrate Manufacturer

2024-02-28 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Global Semiconductor Substrate Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology

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Module Substates

2024-02-27 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Professional Module Substates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing Module packaging substrate and HDI PCBs.

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FC-CSP Substrates Manufacturer

2024-02-26 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FC-CSP Substrates Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

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CPCORE Structure Manufacturer

2024-02-23 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

CPCORE Structure Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers,

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SHDBU Substrate Manufacture

2024-02-22 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

SHDBU Substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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+086 0755 85241496

service@qycltd.com

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