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High Speed package Substrate

2024-02-21 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

High Speed package Substrate Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology

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High Frequency package Substrate

2024-02-20 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Professional High Frequency Substrate Manufacturer, we mainly produce ultra-small bump pitch package substrate, ultra-small trace and spacing packaging substrate and microtrace HDI PCBs.

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High precision packaging substrate Manufacturer

2024-02-19 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

High precision packaging substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

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Organic FC BGA substrate

2024-02-18 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Organic FC BGA substrate Manufacturer and package substrate production. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers,

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Ajinomoto Package Substrate

2024-02-17 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ajinomoto Package Substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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FCCSP Flip Chip Package Substrate Manufacturing

2024-02-16 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCCSP Flip Chip Package Substrate Manufacturing. High speed and high frequency material packaging substrate production. Advanced packaging substrate production process and technology.

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+086 0755 85241496

service@qycltd.com

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