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Flip Chip CSP Package Substrate

2024-02-09 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip CSP Package Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

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Chip-scale Package Substrate Manufacturer

2024-02-08 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Chip-scale package Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers.

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Cavity Substrate/PCB Manufacturer

2024-02-07 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Cavity Substrate/PCB Manufacturer the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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FCCSP Flip Chip CSP Substrate Manufacturer

2024-02-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCCSP Flip Chip CSP substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

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Embedded Cavity PCB/Substrate Manufacturer

2024-02-05 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Professional Embedded Cavity PCB/Substrate Manufacturer, we mainly produce ultra-small bump pitch Cavity substrate/PCBs, ultra-small trace and spacing packaging cavity substrate and HDI Cavity PCBs.

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Flip Chip CSP (FCCSP) Manufacturer

2024-02-02 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip CSP (FCCSP) Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

Read more

+086 0755 85241496

service@qycltd.com

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