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What is an Advance Semiconductor substrate manufacturer?

2024-01-16 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Advance Semiconductor substrate Vender. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

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What is Advanced Semiconductor Substrate?

2024-01-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Advance Semiconductor substrate supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and Microtrace HDI PCBs.

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What is Advanced Packaging Substrate?

2024-01-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Advanced packaging substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

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What is this Rigid-Flex BGA Substrate?

2024-01-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Rigid-flex BGA substrate Vender and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,

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What is Rigid-Flex Packaging Substrate?

2024-01-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Rigid-flex packaging substrate manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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What is Ceramic Packaging Substrate?

2024-01-09 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ceramic Packaging Substrate Vender .High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

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+086 0755 85241496

service@qycltd.com

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