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What Defines FCBGA Substrate?

2023-12-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip-Chip Ball Grid Array. FC-BGA Package and FC BGA Substrate Manufacturer. High precision production lines, high speed material, high frequency material. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers,

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FCBGA Packaging Substrate Firm

2023-12-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

(Flip-Chip Ball Grid Array) FC/BGA Packaging Substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 20 layers.

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What Defines FCBGA Package Substrate?

2023-12-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCBGA Package Substrate Company. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high

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Package Substrate Manufacturing Company

2023-12-08 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Package Substrate Manufacturing Company. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 20 layers,

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What is a Packaging Substrate?

2023-12-07 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Packaging Substrate Seller. We offer BGA substrates from 2 layer to 20 layers.A Packaging Substrate refers to a fundamental component in electronic devices responsible for providing structural support and electrical connections for semiconductor chips (ICs) within the device. It serves as a crucial intermediary between the chip and the rest…

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What is a Flip Chip Package Substrates?

2023-12-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip Package Substrates Supply. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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+086 0755 85241496

service@qycltd.com

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