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IC/BGA Substrate Design: Unveiling the Key Aspects

2023-11-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

IC/BGA substrate manufacture. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. In the ever-evolving realm of modern electronics, substrate design stands as a cornerstone technology.…

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Innovative Organic Substrate Packaging: Elevating Your Product’s Performance

2023-10-31 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Organic Substrate Packaging manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.In the ever-evolving landscape of modern technology, the term "organic substrate packaging" has emerged as a pivotal cornerstone, catalyzing the transformation of electronic and engineering industries. At its core, organic substrate packaging…

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Revolutionizing Substrate Packaging Technology: A Comprehensive Overview

2023-10-31 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

We are a professional packaging substrate supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.In today's rapidly evolving technological landscape, substrate packaging stands as a pivotal enabler, facilitating the seamless integration of intricate electronic components within a myriad of devices. As the backbone…

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IC Package Substrate Manufacture

2023-10-30 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ic package substrate manufacture. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. In the dynamic world of electronics, IC Package Substrates take center stage. These…

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FC-BGA Packaging Substrate

2023-10-30 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FC-BGA Packaging Substrate maker.Exploring AJINOMOTO's Cutting-Edge Substrate Materials: ABF Series (GX92R, GXT31R2, GZ41R2H, GL102R8HF)In the realm of advanced materials and technology, AJINOMOTO emerges as a leading innovator, consistently setting new standards in substrate materials. The ABF series, featuring materials such as GX92R, GXT31R2, GZ41R2H, and GL102R8HF, epitomizes AJINOMOTO's commitment to…

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Flip Chip Packaging Substrate

2023-10-27 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Hersteller von Flip-Chip-Gehäuse-Substraten. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.It is an electronic packaging technology that provides connection and support between electronic components and printed circuit boards. This technology “flips” an integrated circuit…

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