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  RT/duroid® 5880 Laminates PCB

  2024-04-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  RT/duroid® 5880 Laminates PCB RT/duroid® 5880 Laminates PCB manufacturing, Rogers series materials PCB Vendor, we offer Rogers PCBs from 2 layer to 30 layers, Characteristic: Microtrace, Small spacing, HDI Mixed dielectric layer, Cavity Rogers PCBs, Antenna, Radar, and other types Rogers PCBs producer. RT/duroid® 5880 is a high-performance RF/microwave laminate…

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  Minimum spacing PCB manufacturing

  2024-04-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  Minimum spacing PCB manufacturing Minimum spacing PCB manufacturing, Suitable for small pitch LED PCB, HDI PCB, BGA package substrates. we offer Minimum spacing PCB and Minimum spacing BGA substrates from 2 layer to 22 layers. the best smallest spacing are 9um. A Minimum Spacing PCB is a type of printed…

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  Glass Substrates

  2024-04-14 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  Glass Substrates Glass Substrates Manufacturing, Advanced production technology, advanced substrate, stable quality, the finished surface is more flat, more high temperature resistance, we produce glass packaging substrate from 2 layers to 20 layers. Glass substrates serve as the fundamental building blocks for various technological applications, providing a stable and transparent…

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  96AL2O3 Ceramic PCB

  2024-04-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  96AL2O3 Ceramic pcb 96AL2O3 Ceramic PCB Manufacturing, We offer Ceramic PCB and Ceramic package substrates with microtrace, and smallest spacing. Our company made the Ceramic substrates from 1 layer to 22 layers . 96% AL2O3 ceramic PCBs, also known as aluminum oxide ceramic PCBs, are substrates made from high-purity alumina…

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  Microtrace PCB

  2024-04-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  Microtrace PCB manufacturing Microtrace PCB manufacturing, 9UM trace and 9um gap, we use the ABF to produce the Microtrace PCB or BGA substrates. when your trace are more bigger than 25um. we can use the BT materials or other types materials. we offer the Microtrace PCB and Microtrace BGA substrates…

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  (MIS)Geformtes Verbindungssubstrat

  2024-04-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

  (MIS)Geformtes Verbindungssubstrat (MIS)Molded Interconnect Substrate manufacturer, we use the BT materials, ABF materials, r use other high speed and high frequency materials to produce such packaging substrates from 2 layer to 22 layers. Microtrace and small gap. Molded Interconnect Substrates (MIS) represent a revolutionary advancement in electronic packaging and…

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