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Ultrathin BT PCB manufacturing

2024-03-16 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultrathin BT PCB manufacturing We offer Ultrathin BT PCB, FR4 PCB. 1 layer or 2 layer PCB's ultrathin thickness are 0.05mm(50um) , 0.07mm(70um). 0.1mm(100um). 0.12mm(120um). 0.15MM. the 4 layer and 6 layer PCB finished thickness are from 0.18mm(180um). 0.2mm(200um), 0.25mm to 0.6mm. We will produce the finished PCB boards thickness…

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Mini led pcb manufacturing

2024-03-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Mini led pcb manufacturing What is Mini LED PCB? Mini led pcb manufacturing and package substrate manufacturing. We use advanced Msap and Sap technology to produce smllest spacing mini LED and BGA substrates from 2 to 20 layers. A Mini LED PCB (Printed Circuit Board) is a type of circuit…

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Semiconductor FC BGA substrate Manufacturer

2024-03-14 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Semiconductor FC BGA substrate Manufacturer What is a Semiconductor FC BGA Substrate? Semiconductor FC BGA substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. A semiconductor FC BGA substrate is a type of semiconductor…

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Ceramic package substrate Manufacturer

2024-03-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

What is Ceramic package substrate? Ceramic package substrate Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. A ceramic package substrate, also known as a ceramic substrate or ceramic interposer, is a type of packaging technology used in integrated circuits (ICs) and microelectronic…

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Semiconductor IC substrate Manufacturer

2024-03-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Semiconductor IC substrate Manufacturer What is Semiconductor IC Substrate? We are a professional Semiconductor IC substrate Manufacturer supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. A Semiconductor IC Substrate, often simply referred to as a substrate, is a fundamental component of integrated…

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Substrate package Manufacturer

2024-03-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Substrate package Manufacturer What is Substrate Package? Substrate package Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. A substrate package, often referred to simply…

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+086 0755 85241496

service@qycltd.com

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