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Embedded Cavity Substrate

2024-02-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Embedded Cavity Substrate Manufacturer, Cavity PCB production. We mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and microtrace Cavity PCBs/Substrate.

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Organic Packaging Substrate

2024-02-14 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Organic Packaging Substrate Manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

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BGA Cavity Substrate

2024-02-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

BGA Cavity Substrate Manufacturing and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 20 layers,

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CSP package substrate Manufacturer

2024-02-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

CSP package substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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FCCSP Package Substrate

2024-02-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCCSP Package Substrate Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

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Wire Bonding Package Substrate

2024-02-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Wire Bonding Package Substrate Manufacturer, we mainly produce ultra-small bump pitch packaging substrate, ultra-small trace and spacing packaging substrate and microtrace HDI PCBs.

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+086 0755 85241496

service@qycltd.com

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