Rufen: +086 0755 85241496 E-Mail: service@qycltd.com

Technologie Kontakt |

TradeNews-Page4of307-Flip-ChipPackageSubstratemanufacturer-Page4

Fachnachrichten

Heim

Fachnachrichten

Ultrathin IC/BGA Substrate Manufacturer

2024-07-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultrathin IC/BGA Substrate Manufacturer Ultrathin IC/BGA Substrate Manufacturer，Ultrathin IC/BGA Substrates are specialized components designed for high-density integrated circuit (IC) and Ball Grid Array (BGA) packaging. These substrates feature an exceptionally thin profile, optimizing space within electronic devices while maintaining structural integrity. Engineered with advanced materials like thin-film polymers or reinforced…

Read more
EM827 Materials PCB Manufacturer

2024-07-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

EM827 Materials PCB Manufacturer EM827 Materials PCB Manufacturer,EM827 Materials PCB are advanced laminates renowned for their high-frequency performance and reliability in demanding electronic applications. These materials feature a unique resin system and reinforced glass fabric, offering exceptional thermal stability, low dielectric loss, and excellent dimensional stability. EM827 PCBs are designed…

Read more
BT PCB Manufacturer

2024-07-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

BT PCB Manufacturer BT PCB Manufacturer,BT PCB, or Bismaleimide Triazine Printed Circuit Board, is a high-performance substrate known for its exceptional thermal stability and mechanical strength. It features a resin system composed of bismaleimide and triazine, offering excellent thermal resistance, low thermal expansion, and high glass transition temperature (Tg). BT…

Read more
Ultrathin GPU Package Substrate Manufacturer

2024-07-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultrathin GPU Package Substrate Manufacturer Ultrathin GPU Package Substrate Manufacturer,Ultrathin GPU Package Substrates are specialized components designed for high-performance graphics processing units (GPUs). These substrates feature an exceptionally thin profile, optimizing space within compact electronic devices while maintaining robust structural integrity. Engineered with advanced materials like thin-film polymers or reinforced…

Read more
Minimum Trace PCB Manufacturer

2024-07-09 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Minimum Trace PCB Manufacturer Minimum Trace PCB Manufacturer,Minimum Trace PCB refers to printed circuit boards designed with extremely fine conductor traces. These boards are crucial for applications requiring high-density integration and precise signal routing. By minimizing the width and spacing of conductive traces, Minimum Trace PCBs enable compact and efficient…

Read more
Showa Denko Package Substrate Manufacturer

2024-07-08 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Showa Denko Package Substrate Manufacturer Showa Denko Package Substrate Manufacturer,Showa Denko Package Substrate is a high-performance material used in advanced electronic packaging. Renowned for its superior thermal and mechanical properties, it offers excellent heat dissipation, high reliability, and enhanced electrical performance. These substrates are crucial in the production of integrated…

Read more

+086 0755 85241496

service@qycltd.com

Hinterlasse eine Nachricht