Rufen: +086 0755 85241496 E-Mail: service@qycltd.com

Technologie Kontakt |

TradeNews-Page48of307-Flip-ChipPackageSubstratemanufacturer-Page48

Fachnachrichten

Heim

Fachnachrichten

What material is used for IC packaging?

2023-11-17 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

IC/BGA Package Substrate Material. The Material type and selection of packaging substrate. BT base series, Showa Denko and Ajinomoto(ABF) Base series. or we also can use the Rogers base and other types base materials.

Read more
What is the substrate material for chips?

2023-11-16 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FFlip Chip Package Substrate Provider and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 layers,

Read more
What is WLP in semiconductor?

2023-11-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Embedded Package Substrate Manufacturer.Embedded wafer-level-packages fan-out wlp chip embedded in substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

Read more
What are the substrate materials for packaging?

2023-11-14 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Different types of packaging substrate suppliers, Advanced technology, the use of Sap and Msap production process, stable quality, fast delivery. we produce any types FC BGA substrates.

Read more
What is the Package Substrate?

2023-11-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Professional Package Substrate Offer, we mainly produce ultra-small bump pitch FC BGA Substrate, ultra-small trace and Ultra-small spacing packaging substrate and HDI PCBs.

Read more
What is the substrate in a BGA package?

2023-11-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Advanced package substrate Supplier. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

Read more

+086 0755 85241496

service@qycltd.com

Hinterlasse eine Nachricht