Fabricante de sustratos Flip-Chip Package
- Teléfono: +086 0755 85241496
- Correo electrónico: service@qycltd.com
Notificación
- 2024-02-16 FCCSP Flip Chip Package Substrate Manufacturing
- 2024-02-15 Embedded Cavity Substrate
- 2024-02-14 Organic Packaging Substrate
- 2024-02-13 BGA Cavity Substrate
- 2024-02-12 CSP package substrate Manufacturer