Llamar: +086 0755 85241496 Correo electrónico: service@qycltd.com

Tecnología Contacto |

TradeNews-Page39of307-Flip-ChipPackageSubstratemanufacturer-Page39

Noticias Comerciales

Hogar

Noticias Comerciales

Cavity PCB/Substrate Manufacturer

2024-02-01 Noticias de la empresa / Noticia / Notificación / Noticias Comerciales

Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 20 layers

Read more
What Is ALUMINUM AI2O3 Substrate?

2024-01-31 Noticias de la empresa / Noticia / Notificación / Noticias Comerciales

Ceramic ALUMINUM AI2O3 substrate producer. the Package Substrate will be made with ALUMINUM AI2O3 core materials. or other types Ceramic materials. High quality and fast lead time.

Read more
What is Semiconductor FC BGA Substrate?

2024-01-30 Noticias de la empresa / Noticia / Notificación / Noticias Comerciales

Semiconductor FCBGA substrate Vender. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

Read more
What is Semiconductor BGA Substrate?

2024-01-29 Noticias de la empresa / Noticia / Notificación / Noticias Comerciales

Professional Semiconductor BGA substrate Provider, We produce various types of BGA substrates according to your requirements, advanced Msap with Sap process flow, we can produce ultra-small trace substrate from 2 layers to 20 layers, fast quotation, fast delivery, stable quality.

Read more
What is Rigid-flex BGA Substrate?

2024-01-26 Noticias de la empresa / Noticia / Notificación / Noticias Comerciales

Rigid-flex BGA substrate Provider. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

Read more
What is Rigid-flex Packaging Substrate?

2024-01-25 Noticias de la empresa / Noticia / Notificación / Noticias Comerciales

Rigid-flex packaging substrate Vender. We use the advanced Msap and Sap technology to do the BGA substrate with Rigid-Flex PCBs, High multilayer interconnection substrates from 4 to 20 layers.

Read more

+086 0755 85241496

service@qycltd.com

Deja un mensaje