Llamar: +086 0755 85241496 Correo electrónico: service@qycltd.com

Tecnología Contacto |

 

CavityPCB/SubstrateManufacturerandpackagesubstratemanufacturer.WeuseadvancedMsapandSaptechnology-Page3of13-Flip-ChipPackageSubstratemanufacturer-Page3

Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

  1. Hogar
  2. Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

Teléfono +086 0755 85241496

Whatsapp +8615014077679

Correo electrónico service@qycltd.com

Deja un mensaje