Fabricante de sustratos Flip-Chip Package
- 2024-02-12 CSP package substrate Manufacturer
- 2024-02-11 FCCSP Package Substrate
- 2024-02-10 Wire Bonding Package Substrate
- 2024-02-09 Flip Chip CSP Package Substrate
- 2024-02-02 Flip Chip CSP (FCCSP) Manufacturer
- Teléfono: +086 0755 85241496
- Correo electrónico: service@qycltd.com
