Appeler: +086 0755 85241496 Courriel: service@qycltd.com

Technologie Contact |

TradeNews-Page2of307-Flip-ChipPackageSubstratemanufacturer-Page2

Actualités commerciales

Domicile

Actualités commerciales

Advanced Flip Chip Substrates Manufacturer

2024-07-25 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Advanced Flip Chip Substrates Manufacturer Advanced Flip Chip Substrates Manufacturer,Advanced Flip Chip Substrates are high-performance platforms designed for mounting flip chip integrated circuits. These substrates feature a sophisticated layout with fine-pitch bumps or pads for direct connection to the chip's I/O pads, enabling high-density packaging and enhanced electrical performance. Typically…

Lire la suite
Ultrathin Rigid PCB Manufacturer

2024-07-24 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Ultrathin Rigid PCB Manufacturer Ultrathin Rigid PCB Manufacturer,Ultrathin Rigid PCBs are advanced circuit boards characterized by their exceptionally thin profile while maintaining rigidity and durability. These PCBs are crafted to be lightweight and compact, making them ideal for applications where space is limited, such as in smartphones, wearables, and other…

Lire la suite
Metallized Ceramic Substrates Manufacturer

2024-07-23 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Metallized Ceramic Substrates Manufacturer Metallized Ceramic Substrates Manufacturer,Metallized Ceramic Substrates are advanced electronic components designed for high-performance applications requiring superior thermal and electrical conductivity. These substrates consist of a ceramic base, typically made from materials like alumina or aluminum nitride, which is coated with a metal layer. The metalization process…

Lire la suite
Ultra Thin Multilayer HDI PCBs Manufacturer

2024-07-22 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Ultra Thin Multilayer HDI PCBs Manufacturer Ultra Thin Multilayer HDI PCBs Manufacturer,Ultra Thin Multilayer HDI PCBs (High-Density Interconnect Printed Circuit Boards) are advanced, high-performance boards designed to meet the demands of modern electronic devices. These PCBs feature multiple layers with extremely fine traces and microvias, enabling high component density and…

Lire la suite
Probe Card Substrate Manufacturer

2024-07-21 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Probe Card Substrate Manufacturer Probe Card Substrate Manufacturer,A Probe Card Substrate is a critical component in semiconductor testing, designed to interface with semiconductor devices during electrical testing. It features an array of fine-pitch electrical contacts that align with the device's test points, allowing for precise measurement of electrical characteristics. Made…

Lire la suite
Flip Chip Substrates Manufacturer

2024-07-20 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Flip Chip Substrates Manufacturer Flip Chip Substrates Manufacturer,Flip Chip substrates are advanced packaging solutions designed for high-performance electronic devices. They support flip chip technology, where integrated circuits are mounted face-down on the substrate, allowing for direct electrical connections and enhanced signal integrity. These substrates are crafted from high-quality materials that…

Lire la suite

+086 0755 85241496

service@qycltd.com

Laisser un message