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Actualités commerciales

What Is the Definition of FC BGA Substrate?

2023-12-29 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Semiconductor FC BGA substrate Manufacturer. The best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 9um to 25um trace and spacing.

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What is Semiconductor BGA Substrate?

2023-12-28 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Semiconductor BGA Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 À 20 Couches.

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What Is Rigid-Flex BGA Substrate?

2023-12-27 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Rigid-flex BGA Substrate Supplier. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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What is Rigid-Flex Packaging Substrate?

2023-12-26 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Rigid-flex packaging substrate manufacturing. High speed and high frequency material packaging substrate supplier. Advanced packaging substrate production process and technology.

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What is Ceramic Packaging Substrate?

2023-12-25 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

We are a professional Ceramic substrate supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.

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What is Semiconductor Package Substrate?

2023-12-22 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Semiconductor package and Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 À 20 Couches.

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+086 0755 85241496

service@qycltd.com

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