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What material is used for IC packaging?

2023-11-17 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

IC/BGA Package Substrate Material. The Material type and selection of packaging substrate. BT base series, Showa Denko and Ajinomoto(ABF) Base series. or we also can use the Rogers base and other types base materials.

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What is the substrate material for chips?

2023-11-16 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

FFlip Chip Package Substrate Provider and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 À 20 Couches,

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What is WLP in semiconductor?

2023-11-15 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Embedded Package Substrate Manufacturer.Embedded wafer-level-packages fan-out wlp chip embedded in substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

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What are the substrate materials for packaging?

2023-11-14 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Different types of packaging substrate suppliers, Advanced technology, the use of Sap and Msap production process, stable quality, fast delivery. we produce any types FC BGA substrates.

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What is the Package Substrate?

2023-11-13 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Professional Package Substrate Offer, we mainly produce ultra-small bump pitch FC BGA Substrate, ultra-small trace and Ultra-small spacing packaging substrate and HDI PCBs.

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What is the substrate in a BGA package?

2023-11-10 Nouvelles de l’entreprise / Nouvelles / Notification / Actualités commerciales

Advanced package substrate Supplier. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

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