Appeler: +086 0755 85241496 Courriel: service@qycltd.com

Technologie Contact |

CavityPCB/SubstrateManufacturerandpackagesubstratemanufacturer.WeuseadvancedMsapandSaptechnology-Page2of13-Flip-ChipPackageSubstratemanufacturer-Page2

Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

Domicile

Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

2024-05-09 RF High Frequency substrates Manufacturer
2024-05-08 Ajinomoto(ABF) Fabricant de substrat
2024-05-05 Aviation Substrate Manufacturer
2024-05-03 Ajinomoto GZ41R2H package substrate Manufacturer
2024-04-29 RF Antenna substrate Manufacturer

+086 0755 85241496

service@qycltd.com

Laisser un message