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What are the advantages of organic package substrates?

2023-11-27 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Organic Package Substrate Manufacturer. Advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 20 layer. High speed and high frequency substrates.

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Semiconductor Substrate Manufacturer

2023-11-24 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Semiconductor FCBGA Substrate Manufacturer. Professional semiconductor substrate production lines, 90% of the equipment from Japan, high-precision equipment to produce high-precision multi-layer substrate, we have a variety of high-speed high-frequency inventory materials.

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High Layer Package Substrate Supplier

2023-11-23 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

High layer package substrate supplier. We have produced 20 layer FCBGA substrate with microtrace/Spacing 10um/10um. Use the Showa Denko and Ajinomoto(ABF) base materials.

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BT Packaging Substrate

2023-11-22 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

BT packaging substrate manufacturer. We use BT white core or black core material to produce ultra-small trace LED PCB, or high-frequency high-speed substrate, BT material has a small expansion coefficient, high TG, stable quality, suitable for ultra-small pitch substrate and HDI production process.

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What’s the IC Packaing Substrates?

2023-11-21 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Ic packaging substrates and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 Strati,

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What is the substrate of ICs?

2023-11-20 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

IC Packaging Substrate manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

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