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CavityPCB/SubstrateManufacturerandpackagesubstratemanufacturer.WeuseadvancedMsapandSaptechnology-Flip-ChipPackageSubstratemanufacturer

Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

  1. Casa
  2. Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

Telefono +086 0755 85241496

Contatti +8615014077679

Posta elettronica service@qycltd.com

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