Chiamare: +086 0755 85241496 Posta elettronica: service@qycltd.com

Tecnologia Contatto |

 

CavityPCB/SubstrateManufacturerandpackagesubstratemanufacturer.WeuseadvancedMsapandSaptechnology-Page3of13-Flip-ChipPackageSubstratemanufacturer-Page3

Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

  1. Casa
  2. Cavity PCB/Substrate Manufacturer and package substrate manufacturer. We use advanced Msap and Sap technology

Telefono +086 0755 85241496

Contatti +8615014077679

Posta elettronica service@qycltd.com

Lascia un messaggio