Produttore di substrati per pacchetti Flip-Chip
- 2024-02-21 High Speed package Substrate
- 2024-02-20 High Frequency package Substrate
- 2024-02-19 High precision packaging substrate Manufacturer
- 2024-02-18 Organic FC BGA substrate
- 2024-02-16 FCCSP Flip Chip Package Substrate Manufacturing
- Telefono: +086 0755 85241496
- Posta elettronica: service@qycltd.com
