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Wire Bonding Substrates Manufacturer

2024-05-15 Company News / News / Notification / Trade News

Wire Bonding Substrates Manufacturer Wire Bonding Substrates Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. Wire Bonding Substrates (PCBs) are foundational components in electronic…

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Buried Cavity PCBs Manufacturer

2024-05-14 Company News / News / Notification / Trade News

Buried Cavity PCBs Manufacturer Buried Cavity PCBs Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. Buried Cavity PCBs represent a cutting-edge solution in electronic…

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Advanced Glass Package Substrates Manufacturer

2024-05-14 Company News / News / Notification / Trade News

Advanced Glass Package Substrates Manufacturer Advanced Glass Package Substrates Manufacturer and package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers, Advanced Glass Package Substrates (AGPS) are cutting-edge substrates crafted from specialized glass materials, meticulously engineered to meet the stringent demands of…

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Megtron6 Materials PCB Manufacturer

2024-05-13 Company News / News / Notification / Trade News

Megtron6 Materials PCB Manufacturer Megtron6 Materials PCB Manufacturer and package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers, Megtron6 Materials PCBs represent the pinnacle of high-performance printed circuit board technology. Engineered by Panasonic Corporation, Megtron6 is a cutting-edge epoxy-based laminate material…

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Flip-Chip Substrate Manufacturer

2024-05-13 Company News / News / Notification / Trade News

Flip-Chip Substrate Manufacturer Flip-Chip Substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. Flip-Chip Substrates are advanced semiconductor packaging solutions that revolutionize the way integrated circuits (ICs) are assembled and interconnected. Unlike traditional packaging…

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Ajinomoto Package Substrate Manufacturer

2024-05-12 Company News / News / Notification / Trade News

Ajinomoto Package Substrate Manufacturer Ajinomoto Package Substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. Ajinomoto Package Substrate (APS) represents a cutting-edge solution in the realm of semiconductor packaging. Renowned for its unparalleled thermal…

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