Call: +086 0755 85241496 E-mail: service@qycltd.com

Technology Contact |

Flip-Chip Package Substrate manufacturer

Phone: +086 0755 85241496
E-mail: service@qycltd.com

Menu

Home
Products
News
TECHNOLOGY
Contact
- Inquiry

Search

3DICPackageSubstrate-Flip-ChipPackageSubstratemanufacturer

3D IC Package Substrate

Home

Products

3D IC Package Substrate

QFN Package

QFP Package Substrate

3D IC Package Substrate

Package Substrate
Small Spacing Substrates
Cavity package substrate
Semiconductor packaging substrate provider
High frequency package substrate
Ceramic packaging substrate
High speed materials substrate
Rogers PCB
WLP Package Substrate
POP Package Substrate
CSP Package Substrate
SIP Package Substrate
SOP Package Substrate
PGA Package Substrate

SIP Package Substrate

FCBGA Package Substrates

QUICK LINKS

PRODUCTS

WLP Package Substrate

POP Package Substrate

CSP Package Substrate

SIP Package Substrate

SOP Package Substrate

PGA Package Substrate

CONTACT US

Phone: +086 0755 85241496

E-mail: service@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Business hours:Monday – Saturday 8.30am – 6pm

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

SEND MESSAGE TO US

Δ

Copyright © 2022 SHENZHEN QYC CO.,LTD All Rights Reserved.

About Us Contact Us Privacy Policy

+086 0755 85241496

service@qycltd.com

Leave a message

Δ