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IPC Class III PCB Manufacturer

2024-05-03 Notícias da empresa / Notícia / Notificação / Notícias comerciais

IPC Class III PCB Manufacturer IPC Class III PCB Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. e a menor lacuna é de 9um. A maior parte do projeto é de 15um a 30um de traço e espaçamento. IPC Class III PCBs represent the pinnacle…

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Ajinomoto GZ41R2H package substrate Manufacturer

2024-05-03 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Ajinomoto GZ41R2H package substrate Manufacturer Ajinomoto GZ41R2H package substrate Manufacturer and package substrate Manufacturer. We use advanced Msap and Sap technology, Substratos de alta interconexão multicamada de 4 Para 18 Camadas, Ajinomoto GZ41R2H package substrate represents a pinnacle of technological advancement in the realm of semiconductor packaging. Crafted with precision and innovation…

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Showa Denko MCL-E-770G package substrate Manufacturer

2024-05-02 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Showa Denko MCL-E-770G package substrate Manufacturer Showa Denko MCL-E-770G package substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. Showa Denko MCL-E-770G package substrates represent a pinnacle of innovation in semiconductor packaging. Engineered by…

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Ultrathin Antenna PCB Manufacturer

2024-05-02 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Ultrathin Antenna PCB Manufacturer Ultrathin Antenna PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology Ultrathin Antenna PCBs represent a cutting-edge solution in the realm of wireless communication technology. These specialized printed circuit boards integrate ultrathin antennas, meticulously designed to operate within…

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Ajinomoto GXT31R2 package substrate Manufacturer

2024-05-01 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Ajinomoto GXT31R2 package substrate Manufacturer We are a professional Ajinomoto GXT31R2 package substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. The Ajinomoto GXT31R2 package substrate represents a pinnacle of semiconductor packaging innovation. Engineered by Ajinomoto Co., Ltd., a renowned Japanese company…

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Radio Frequency Cavity PCB Manufacturer

2024-05-01 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Radio Frequency Cavity PCB Manufacturer Radio Frequency Cavity PCB Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. e a menor lacuna é de 9um. A maior parte do projeto é de 15um a 30um de traço e espaçamento. Radio Frequency (RF) cavity PCBs are specialized…

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