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What is a Flip Chip Package Substrate

2023-12-05 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Flip Chip Package Substrate Manufacturing .High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology

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Ajimomoto Package Substrate

2023-12-04 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Ajimomoto Package Substrate Manufacturing. High speed material and Low CTE (Coefficient of Thermal Expansion). The Package Substrate CTE (Coefficient of Thermal Expansion) refers to the thermal expansion characteristics of the material used in the substrate of electronic packages. The substrate is a foundational component in electronic devices, providing a surface…

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FCBGA Substrate Supply

2023-12-01 Notícias da empresa / Notícia / Notificação / Notícias comerciais

FCBGA Substrate Supply. Introduction of Package substrate Materials. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

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Build-up Structure FC-BGA|Organic Package

2023-11-30 Notícias da empresa / Notícia / Notificação / Notícias comerciais

FC/BGA Structure Substrate Provider. FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.

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Why is an organic substrate commonly used in electronic packaging?

2023-11-29 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Organic Package Substrates Maker. FC-BGA substrates are semiconductor packages with fine design rule and high reliability. QYC provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.

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Build-up Structure FC-BGA

2023-11-28 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Build-up Structure FC-BGA Supply. We offers High Density Build Up (HDBU) substrates using ultra high density routing and 50 micron vias by using laser via formation and dry film resist lamination for high performance flip chip IC devices .

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