Chamar: +086 0755 85241496 E-mail: service@qycltd.com

Tecnologia Contato |

CompanyNews-Page51of307-Flip-ChipPackageSubstratemanufacturer-Page51

Notícias da empresa

Casa

Notícias da empresa

IC/BGA Substrate Design: Unveiling the Key Aspects

2023-11-01 Notícias da empresa / Notícia / Notificação / Notícias comerciais

IC/BGA substrate manufacture. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. e a menor lacuna é de 9um. A maior parte do projeto é de 15um a 30um de traço e espaçamento. In the ever-evolving realm of modern electronics, substrate design stands as a cornerstone technology.…

Ler mais
Innovative Organic Substrate Packaging: Elevating Your Product’s Performance

2023-10-31 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Organic Substrate Packaging manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.In the ever-evolving landscape of modern technology, the term "organic substrate packaging" has emerged as a pivotal cornerstone, catalyzing the transformation of electronic and engineering industries. At its core, organic substrate packaging…

Ler mais
Revolutionizing Substrate Packaging Technology: A Comprehensive Overview

2023-10-31 Notícias da empresa / Notícia / Notificação / Notícias comerciais

We are a professional packaging substrate supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.In today's rapidly evolving technological landscape, substrate packaging stands as a pivotal enabler, facilitating the seamless integration of intricate electronic components within a myriad of devices. As the backbone…

Ler mais
IC Package Substrate Manufacture

2023-10-30 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Ic package substrate manufacture. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. e a menor lacuna é de 9um. A maior parte do projeto é de 15um a 30um de traço e espaçamento. In the dynamic world of electronics, IC Package Substrates take center stage. These…

Ler mais
FC-BGA Packaging Substrate

2023-10-30 Notícias da empresa / Notícia / Notificação / Notícias comerciais

FC-BGA Packaging Substrate maker.Exploring AJINOMOTO's Cutting-Edge Substrate Materials: ABF Series (GX92R, GXT31R2, GZ41R2H, GL102R8HF)In the realm of advanced materials and technology, AJINOMOTO emerges as a leading innovator, consistently setting new standards in substrate materials. The ABF series, featuring materials such as GX92R, GXT31R2, GZ41R2H, and GL102R8HF, epitomizes AJINOMOTO's commitment to…

Ler mais
Flip Chip Packaging Substrate

2023-10-27 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Fabricante de substrato de pacote Flip-Chip. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.It is an electronic packaging technology that provides connection and support between electronic components and printed circuit boards. This technology “flips” an integrated circuit…

Ler mais

+086 0755 85241496

service@qycltd.com

Deixe um recado