Fabricante de substrato de pacote Flip-Chip
- Telefone: +086 0755 85241496
- E-mail: service@qycltd.com
Notificação
- 2024-02-16 FCCSP Flip Chip Package Substrate Manufacturing
- 2024-02-15 Embedded Cavity Substrate
- 2024-02-14 Organic Packaging Substrate
- 2024-02-13 BGA Cavity Substrate
- 2024-02-12 CSP package substrate Manufacturer