Fabricante de substrato de pacote Flip-Chip
- Telefone: +086 0755 85241496
- E-mail: service@qycltd.com
Notícia
- 2024-02-11 FCCSP Package Substrate
- 2024-02-10 Wire Bonding Package Substrate
- 2024-02-09 Flip Chip CSP Package Substrate
- 2024-02-08 Chip-scale Package Substrate Manufacturer
- 2024-02-07 Cavity Substrate/PCB Manufacturer