Chamar: +086 0755 85241496 E-mail: service@qycltd.com

Tecnologia Contato |

TradeNews-Page10of307-Flip-ChipPackageSubstratemanufacturer-Page10

Notícias comerciais

Casa

Notícias comerciais

Multilayer Substrate Manufacturer

2024-06-07 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Multilayer Substrate Manufacturer Multilayer Substrate Manufacturer,Multilayer substrates are sophisticated materials crucial in modern electronics. Comprising multiple layers of diverse materials, such as fiberglass-reinforced epoxy resin (FR4) and conductive copper foils, these substrates facilitate the intricate interconnection of electronic components. Their layered structure enables compact designs, optimal signal integrity, and efficient…

Ler mais
ABF(Ajinomoto) FCBGA Substrate Manufacturer

2024-06-05 Notícias da empresa / Notícia / Notificação / Notícias comerciais

ABF(Ajinomoto) FCBGA Substrate Manufacturer ABF(Ajinomoto) FCBGA Substrate Manufacturer,ABF FCBGA Substrates are advanced packaging solutions for high-performance integrated circuits. Utilizing a build-up film process, these substrates feature multiple layers of insulating material and conductive traces, enabling dense interconnections and efficient signal transmission. With flip chip bonding technology, the IC die is…

Ler mais
LED Ceramic Substrate Manufacturer

2024-06-04 Notícias da empresa / Notícia / Notificação / Notícias comerciais

LED Ceramic Substrate Manufacturer LED Ceramic Substrate Manufacturer,LED ceramic substrates serve as a critical component in LED technology, providing a robust platform for mounting and interconnecting LED chips. Made from materials like aluminum oxide, aluminum nitride, or silicon nitride, these substrates excel in thermal management, efficiently dissipating heat to prolong…

Ler mais
Ultra-small PCS BGA Substrates Manufacturer

2024-06-03 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Ultra-small PCS BGA Substrates Manufacturer Ultra-small PCS BGA Substrates Manufacturer,Ultra-small BGA substrates are cutting-edge packaging solutions for semiconductor devices, renowned for their compact size and high performance. These substrates feature densely packed solder balls, facilitating seamless integration of integrated circuits in space-constrained electronic devices. With advanced materials and precision manufacturing…

Ler mais
Rogers Ro4003c Substrate Manufacturer

2024-06-02 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Rogers Ro4003c Substrate Manufacturer Rogers Ro4003c Substrate Manufacturer,Rogers RO4003C Substrate is a high-frequency material renowned for its exceptional performance in RF and microwave circuits. With a stable dielectric constant of approximately 3.38 and a low dissipation factor of 0.0027, it ensures minimal signal loss and superior signal integrity. This substrate…

Ler mais
Hybrid Layer Buildup Rogers 4350B/FR4 PCB Manufacturer

2024-06-01 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Hybrid Layer Buildup Rogers 4350B/FR4 PCB Manufacturer Hybrid Layer Buildup Rogers 4350B/FR4 PCB Manufacturer,Hybrid Layer Buildup Rogers 4350B/FR4 PCBs integrate the exceptional electrical properties of Rogers 4350B with the structural support and cost-effectiveness of FR4. This hybrid construction ensures high-frequency signal integrity while optimizing manufacturing costs. Ideal for applications demanding…

Ler mais

+086 0755 85241496

service@qycltd.com

Deixe um recado