Chamar: +086 0755 85241496 E-mail: service@qycltd.com

Tecnologia Contato |

TradeNews-Page15of307-Flip-ChipPackageSubstratemanufacturer-Page15

Notícias comerciais

Casa

Notícias comerciais

Showa Denko Substrate Manufacturer

2024-05-12 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Showa Denko Substrate Manufacturer Showa Denko Substrate Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology Showa Denko Substrate (SDS) is a high-quality aluminum-magnesium alloy substrate used in the manufacturing of hard disk drives (HDDs). These substrates provide a stable and flat surface…

Ler mais
MW2000 Materials PCB Manufacturer

2024-05-11 Notícias da empresa / Notícia / Notificação / Notícias comerciais

MW2000 Materials PCB Manufacturer MW2000 Materials PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology MW2000 Materials PCBs represent a pinnacle of innovation in high-frequency electronics. Constructed using specialized MW2000 materials, these PCBs offer unparalleled performance in applications where signal integrity is…

Ler mais
Microvia Package Substrate Manufacturer

2024-05-11 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Microvia Package Substrate Manufacturer We are a professional Microvia Package Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, substrato de embalagem de traço e espaçamento ultrapequeno e PCBs. Microvia Package Substrate is a pivotal component in modern electronic packaging, revolutionizing the way electronic devices are designed and manufactured. This advanced substrate technology…

Ler mais
Step Cavity Package Substrate Manufacturer

2024-05-10 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Step Cavity Package Substrate Manufacturer We are a professional Step Cavity Package Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, substrato de embalagem de traço e espaçamento ultrapequeno e PCBs. Step Cavity Package Substrates (SCPS) are innovative solutions in semiconductor packaging, revolutionizing the integration of semiconductor dies within electronic devices. These substrates…

Ler mais
Semiconductor Glass Substrates Manufacturer

2024-05-10 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Semiconductor Glass Substrates Manufacturer Semiconductor Glass Substrates Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. e a menor lacuna é de 9um. A maior parte do projeto é de 15um a 30um de traço e espaçamento. Mixed dielectric Rogers PCBs combine different dielectric materials within…

Ler mais
ZBC2000 Materials PCB Manufacturer

2024-05-09 Notícias da empresa / Notícia / Notificação / Notícias comerciais

ZBC2000 Materials PCB Manufacturer ZBC2000 Materials PCB Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. e a menor lacuna é de 9um. A maior parte do projeto é de 15um a 30um de traço e espaçamento. ZBC2000 Materials PCBs represent the pinnacle of modern circuit…

Ler mais

+086 0755 85241496

service@qycltd.com

Deixe um recado