Chamar: +086 0755 85241496 E-mail: service@qycltd.com

Tecnologia Contato |

 

FlipChipPackageSubstrate-Flip-ChipPackageSubstratemanufacturer

Flip Chip Package Substrate

  1. Casa
  2. Produtos
  3. Flip Chip Package Substrate
QFN Package

Pacote QFN
PGA Package Substrate

Substrato do pacote PGA
SIP Package Substrate

Substrato do pacote SIP
WLP Package Substrate

Substrato do pacote WLP
Flip-Chip Package Substrate

Substrato do pacote Flip-Chip

Telefone +086 0755 85241496

Linkedin +8615014077679

E-mail service@qycltd.com

Deixe um recado