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Производитель подложек Showa Denko

2024-05-12 Новости компании / Новости / Уведомление / Новости торговли

Showa Denko Substrate Manufacturer Showa Denko Substrate Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology Showa Denko Substrate (SDS) is a high-quality aluminum-magnesium alloy substrate used in the manufacturing of hard disk drives (HDDs). These substrates provide a stable and flat surface…

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MW2000 Materials PCB Manufacturer

2024-05-11 Новости компании / Новости / Уведомление / Новости торговли

MW2000 Materials PCB Manufacturer MW2000 Materials PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology MW2000 Materials PCBs represent a pinnacle of innovation in high-frequency electronics. Constructed using specialized MW2000 materials, these PCBs offer unparalleled performance in applications where signal integrity is…

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Microvia Package Substrate Manufacturer

2024-05-11 Новости компании / Новости / Уведомление / Новости торговли

Microvia Package Substrate Manufacturer We are a professional Microvia Package Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Microvia Package Substrate is a pivotal component in modern electronic packaging, revolutionizing the way electronic devices are designed and manufactured. This advanced substrate technology…

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Step Cavity Package Substrate Manufacturer

2024-05-10 Новости компании / Новости / Уведомление / Новости торговли

Step Cavity Package Substrate Manufacturer We are a professional Step Cavity Package Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Step Cavity Package Substrates (SCPS) are innovative solutions in semiconductor packaging, revolutionizing the integration of semiconductor dies within electronic devices. These substrates…

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Semiconductor Glass Substrates Manufacturer

2024-05-10 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor Glass Substrates Manufacturer Semiconductor Glass Substrates Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. Mixed dielectric Rogers PCBs combine different dielectric materials within…

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ZBC2000 Materials PCB Manufacturer

2024-05-09 Новости компании / Новости / Уведомление / Новости торговли

ZBC2000 Materials PCB Manufacturer ZBC2000 Materials PCB Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. ZBC2000 Materials PCBs represent the pinnacle of modern circuit…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство упаковочных материалов, которые мы используем, поставляются из Японии. Южная Корея.Качество материала основания очень стабильное.

+086 0755 85241496

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