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3D Ceramic Packages Substrate manufacturing

2024-03-25 Новости компании / Новости / Уведомление / Новости торговли

3D Ceramic Packages Substrate manufacturing 3D Ceramic Packages Substrate manufacturing, Advanced 3D production technology, professional team, fast delivery, stable quality. We produce various ceramic substrates and PCBs. 3D Ceramic Packages Substrates represent a cutting-edge advancement in semiconductor packaging technology. These substrates are engineered with multiple layers of ceramic material, intricately…

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Mixed dielectric PCB manufacturing

2024-03-25 Новости компании / Новости / Уведомление / Новости торговли

Mixed dielectric PCB manufacturing Mixed dielectric PCB manufacturing, FR4/High speed/high frequency Mixed dielectric PCB manufacturer. Professional PCB production company. High quality and fast lead time. Mixed Dielectric PCBs are advanced printed circuit boards that integrate multiple types of dielectric materials within their construction. Unlike traditional PCBs that use a single…

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Embedded IC PCB manufacturing

2024-03-24 Новости компании / Новости / Уведомление / Новости торговли

Embedded IC PCB manufacturing Embedded IC PCB manufacturing, Open a cavity or multiple cavity on the PCBs substrates. and put the IC in the cavity and assemble. we made this cavity PCBs from 4 layer to 30 Слои. Advanced production technology and fast shipping time. Embedded IC PCBs, or Embedded…

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Microvia Substrates manufacturing

2024-03-23 Новости компании / Новости / Уведомление / Новости торговли

Microvia Substrates manufacturing Microvia Substrates manufacturing. Extra small size via holes HDI PCBs or Microvia Package BGA Substrates manufacturer. the best samllest laser via hole size are 50um. when you design this smaller via holes. The thickness of each layer of dielectric should also be designed to be thinner. Microvia…

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Embedded cavity PCB manufacturing

2024-03-22 Новости компании / Новости / Уведомление / Новости торговли

Embedded cavity PCB manufacturing Embedded cavity PCB manufacturing. Open Cavity on the PCB substrates. Open one or Open multi-Cavity on the PCBs. we have made this types cavity PCB from 3 layer to 30 Слои. High quality and fast lead time. and We used the base material as you requested.…

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Multi cavity substrates manufacturing

2024-03-21 Новости компании / Новости / Уведомление / Новости торговли

Multi cavity substrates manufacturing Multi Cavity Substrates Manufacturing. Open multiple cavity on the PCB or BGA substrates. Professional Cavity Substrates supplier. we offer Cavity PCBs from 3 layer to 30 Слои. Multi cavity substrates (MCS) are specialized substrates utilized in electronic manufacturing, particularly in high-frequency applications such as wireless communication…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство упаковочных материалов, которые мы используем, поставляются из Японии. Южная Корея.Качество материала основания очень стабильное.

+086 0755 85241496

service@qycltd.com

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