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Advanced Glass Substrates Manufacturer

2024-07-01 Новости компании / Новости / Уведомление / Новости торговли

Advanced Glass Substrates Manufacturer Advanced Glass Substrates Manufacturer,Advanced Glass Substrates represent a pinnacle in modern electronics, offering exceptional durability, thermal stability, and performance in diverse applications. Engineered with precision, these substrates integrate sophisticated glass-ceramic materials, combining low dielectric properties with high mechanical strength. They facilitate high-density interconnects for microelectronics, enabling…

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Showa Denko Package Substrate Manufacturer

2024-06-30 Новости компании / Новости / Уведомление / Новости торговли

Showa Denko Package Substrate Manufacturer Showa Denko Package Substrate Manufacturer,Showa Denko Package Substrate is a high-performance packaging substrate designed to meet the stringent requirements of modern electronic devices. Utilizing advanced materials and processes, it offers excellent thermal conductivity and electrical performance, suitable for high-density and high-speed applications. Its stable structure…

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Megtron7 Materials PCB Manufacturer

2024-06-29 Новости компании / Новости / Уведомление / Новости торговли

Megtron7 Materials PCB Manufacturer Megtron7 Materials PCB Manufacturer,Megtron7 PCB material is a high-performance glass fiber-reinforced epoxy resin substrate known for its excellent high-frequency characteristics and thermal stability. Designed to meet the demands of modern electronic devices for high-speed signal transmission and complex circuit layouts, Megtron7 PCB material supports high-frequency applications…

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ABF Package Substrate Manufacturer

2024-06-28 Новости компании / Новости / Уведомление / Новости торговли

ABF Package Substrate Manufacturer ABF Package Substrate Manufacturer,ABF Package Substrate is an advanced organic packaging substrate manufactured using Advanced Colloidal Copper (ACF) technology. It is lightweight and offers excellent electrical properties and thermal stability, catering to the packaging needs of high-density and high-speed electronic devices. ABF Package Substrate is extensively…

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Mitsubishi BT Substrate Manufacturer

2024-06-27 Новости компании / Новости / Уведомление / Новости торговли

Mitsubishi BT Substrate Manufacturer Mitsubishi BT Substrate Manufacturer,Mitsubishi BT Substrate is a high-performance packaging substrate manufactured using High Temperature Co-Fired Ceramic (HTCC) technology. It boasts excellent thermal stability and electrical properties, making it ideal for demanding high-power electronic devices and microwave applications. Through its multi-layered structure and precise manufacturing processes,…

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Minimum Spacing PCB Manufacturer

2024-06-26 Новости компании / Новости / Уведомление / Новости торговли

Minimum Spacing PCB Manufacturer Minimum Spacing PCB Manufacturer,Minimum Spacing PCB refers to printed circuit boards designed with extremely close spacing between conductive traces and components. This design approach allows for compact and densely packed electronic assemblies, crucial for achieving miniaturization in modern electronics. Minimum Spacing PCBs require precise manufacturing techniques…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство упаковочных материалов, которые мы используем, поставляются из Японии. Южная Корея.Качество материала основания очень стабильное.

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