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Genclad Materials PCB Manufacturer

2024-06-25 Новости компании / Новости / Уведомление / Новости торговли

Genclad Materials PCB Manufacturer Genclad Materials PCB Manufacturer,Genclad Materials PCB is an advanced printed circuit board substrate known for its exceptional performance in high-frequency and high-speed applications. It features a unique laminate construction with enhanced dielectric properties, providing low signal loss and stable electrical characteristics across a broad frequency range.…

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Производитель подложек для проволочного соединения

2024-06-24 Новости компании / Новости / Уведомление / Новости торговли

Wire Bonding Substrates Manufacturer Wire Bonding Substrates Manufacturer,Wire Bonding Substrates are crucial components in semiconductor and microelectronics packaging, providing a stable platform for connecting integrated circuits (ICs) to external circuits using fine wires. These substrates, often made from materials like alumina, aluminum nitride, or organic laminates, offer excellent thermal conductivity…

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CPU Package Substrates Manufacturer

2024-06-23 Новости компании / Новости / Уведомление / Новости торговли

CPU Package Substrates Manufacturer CPU Package Substrates Manufacturer,CPU Package Substrates are crucial components that provide electrical and mechanical support for central processing units (CPUs) in electronic devices. These substrates are designed with high-density interconnects (HDI) to ensure efficient communication between the CPU and other system components. They feature advanced materials…

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N4000-13 Series Materials PCB Manufacturer

2024-06-22 Новости компании / Новости / Уведомление / Новости торговли

N4000-13 Series Materials PCB Manufacturer N4000-13 Series Materials PCB Manufacturer,The N4000-13 Series Materials PCB is a specialized substrate material tailored for high-frequency and microwave applications. Known for its exceptional electrical properties, this material is typically based on a ceramic or PTFE (polytetrafluoroethylene) composition, offering low dielectric loss and high thermal…

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RF High Frequency Package Substrates Manufacturer

2024-06-21 Новости компании / Новости / Уведомление / Новости торговли

RF High Frequency Package Substrates Manufacturer RF High Frequency Package Substrates Manufacturer,RF High Frequency Package Substrates are critical components designed to handle high-frequency signals, widely used in wireless communication, radar, and satellite communication. These substrates utilize high-quality high-frequency materials like PTFE (polytetrafluoroethylene), offering low dielectric loss and excellent signal transmission…

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Open multi-Cavity PCB Manufacturer

2024-06-20 Новости компании / Новости / Уведомление / Новости торговли

Open multi-Cavity PCB Manufacturer Open multi-Cavity PCB Manufacturer,Open multi-cavity PCBs are specialized printed circuit boards featuring multiple cavities or cutouts within their structure. These cavities are strategically placed openings in the PCB substrate, often used to house components, reduce weight, or enhance thermal management. Open multi-cavity PCBs are designed with…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство упаковочных материалов, которые мы используем, поставляются из Японии. Южная Корея.Качество материала основания очень стабильное.

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