Производитель подложек для упаковки Flip-Chip
- Телефон: +086 0755 85241496
- Электронная почта: service@qycltd.com
Новости
- 2023-11-08 What is BT substrate?
- 2023-11-07 What are the rules for BGA substrate design?
- 2023-11-07 What are the design considerations for BGA package substrates?
- 2023-11-06 What is a system in packaging SiP?
- 2023-11-06 Which is the most commonly used substrate semiconductor