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Multilayer Substrate Manufacturer

2024-06-07 Новости компании / Новости / Уведомление / Новости торговли

Multilayer Substrate Manufacturer Multilayer Substrate Manufacturer,Multilayer substrates are sophisticated materials crucial in modern electronics. Comprising multiple layers of diverse materials, such as fiberglass-reinforced epoxy resin (FR4) and conductive copper foils, these substrates facilitate the intricate interconnection of electronic components. Their layered structure enables compact designs, optimal signal integrity, and efficient…

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АБФ(Адзиномото) FCBGA Substrate Manufacturer

2024-06-05 Новости компании / Новости / Уведомление / Новости торговли

АБФ(Адзиномото) FCBGA Substrate Manufacturer ABF(Адзиномото) FCBGA Substrate Manufacturer,ABF FCBGA Substrates are advanced packaging solutions for high-performance integrated circuits. Utilizing a build-up film process, these substrates feature multiple layers of insulating material and conductive traces, enabling dense interconnections and efficient signal transmission. With flip chip bonding technology, the IC die is…

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LED Ceramic Substrate Manufacturer

2024-06-04 Новости компании / Новости / Уведомление / Новости торговли

LED Ceramic Substrate Manufacturer LED Ceramic Substrate Manufacturer,LED ceramic substrates serve as a critical component in LED technology, providing a robust platform for mounting and interconnecting LED chips. Made from materials like aluminum oxide, aluminum nitride, or silicon nitride, these substrates excel in thermal management, efficiently dissipating heat to prolong…

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Ultra-small PCS BGA Substrates Manufacturer

2024-06-03 Новости компании / Новости / Уведомление / Новости торговли

Ultra-small PCS BGA Substrates Manufacturer Ultra-small PCS BGA Substrates Manufacturer,Ultra-small BGA substrates are cutting-edge packaging solutions for semiconductor devices, renowned for their compact size and high performance. These substrates feature densely packed solder balls, facilitating seamless integration of integrated circuits in space-constrained electronic devices. With advanced materials and precision manufacturing…

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Rogers Ro4003c Substrate Manufacturer

2024-06-02 Новости компании / Новости / Уведомление / Новости торговли

Rogers Ro4003c Substrate Manufacturer Rogers Ro4003c Substrate Manufacturer,Rogers RO4003C Substrate is a high-frequency material renowned for its exceptional performance in RF and microwave circuits. With a stable dielectric constant of approximately 3.38 and a low dissipation factor of 0.0027, it ensures minimal signal loss and superior signal integrity. This substrate…

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Hybrid Layer Buildup Rogers 4350B/FR4 PCB Manufacturer

2024-06-01 Новости компании / Новости / Уведомление / Новости торговли

Hybrid Layer Buildup Rogers 4350B/FR4 PCB Manufacturer Hybrid Layer Buildup Rogers 4350B/FR4 PCB Manufacturer,Hybrid Layer Buildup Rogers 4350B/FR4 PCBs integrate the exceptional electrical properties of Rogers 4350B with the structural support and cost-effectiveness of FR4. This hybrid construction ensures high-frequency signal integrity while optimizing manufacturing costs. Ideal for applications demanding…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство упаковочных материалов, которые мы используем, поставляются из Японии. Южная Корея.Качество материала основания очень стабильное.

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